Amivion PEA-22
Amivion PEA-22 is a polypropylene oxide-based difunctional polyetheramine used as an epoxy resin curing agent, delivering flexible, impact-resistant, blush-resistant networks for protective coatings, adhesives, and composite applications.
Epovion SOL-S 40
Epovion SOL-S 40 is a bisphenol-A based solid epoxy resin with a relatively lower molecular weight compared to higher solid grades.
It is designed for use in epoxy resin solutions, laminates, and molding applications where balanced flow behavior and cured performance are required.
Epovion SOL-S 90
Epovion SOL-S 90 is a bisphenol-A based solid epoxy resin.
It is typically used to prepare epoxy resin solutions for industrial and anticorrosive coating systems, where film build, adhesion, and formulation stability are required.
Epovion BPA-SOL 90
Epovion BPA-SOL 90 is a bisphenol-A based epoxy resin supplied as a solvent solution.
It is designed for use in industrial coating formulations, particularly anticorrosive systems, where good film formation, application performance, and compatibility with polyamide or polyamine curing agents are required.
Epovion BPF-L 17
Epovion BPF-L 17 is an undiluted bisphenol-F based epoxy resin characterized by lower viscosity and higher flow compared with conventional bisphenol-A epoxy resins.
It is designed for solvent-free epoxy formulations where good processability, adhesion, and formulation flexibility are required.
Epovion BPA-L 17
Epovion BPA-L 17 is an undiluted bisphenol-A based epoxy resin with lower viscosity compared to higher molecular weight grades.
It is designed for use in epoxy formulations cured with polyamine or polyamide curing agents, where balanced processability and cured performance are required.
Perovion BCHPC P16
Perovion BCHPC 16 is an organic peroxide based on di(4-tert-butylcyclohexyl) peroxydicarbonate chemistry, supplied in solid form.
It is designed for use as an initiator in polymerization processes where controlled reaction behavior at moderate temperatures is required, including suspension and bulk polymerization systems.
Perovion LPO FLA
Perovion DLP LA is an organic peroxide based on dilauroyl peroxide chemistry, supplied in solid form.
It is designed for use as an initiator in polymerization processes where controlled reaction behavior at moderate temperatures is required, including applications in polymer production and specialty resin systems.
Perovion CHP L90
Perovion CHP L90 is an organic peroxide based on cumyl hydroperoxide chemistry, supplied as a liquid.
It is designed for use as an initiator in polymerization and curing processes where relatively higher peroxide activity is required across a broad processing temperature range.
Perovion CHP L80
Perovion CHP L80 is an organic peroxide based on cumyl hydroperoxide chemistry, supplied as a liquid.
It is designed for use as an initiator in polymerization and curing processes, including applications requiring controlled peroxide activity across a broad temperature range.