Epovion BPF-L 17 is a low-viscosity, undiluted bisphenol-F diglycidyl ether epoxy resin, offering higher flow characteristics and lower viscosity than comparable bisphenol-A epoxy resins. It is formulated for solvent-free coatings, adhesives, civil engineering formulations, electrical insulation materials, and molding and casting systems.
Epovion BPF-L 17 Overview
Epovion BPF-L 17 belongs to the family of bisphenol-F epoxy resins, distinguished from bisphenol-A resins by a methylene bridge in place of the isopropylidene group, which gives bisphenol-F resins a lower inherent viscosity at equivalent molecular weight. This structural difference is what allows Epovion BPF-L 17 to achieve significantly higher flow and better wet-out on substrates and reinforcing fibers than standard bisphenol-A liquid resin, without requiring reactive diluents that can compromise cured film properties.
Because the resin is supplied undiluted, formulators retain full control over final system viscosity and reactivity, adding diluents or fillers only where the target application requires them.
Key Features
- Bisphenol-F chemistry: Epovion BPF-L 17 is a diglycidyl ether of bisphenol-F (DGEBF) epoxy resin.
- Low viscosity, undiluted grade: The resin delivers low viscosity without the need for reactive diluents.
- Higher flow than BPA resins: Lower inherent viscosity supports better wet-out and penetration than comparable bisphenol-A resins.
- Solvent-free formulation ready: The resin is well suited to 100% solids coating and casting systems.
- Good toughness and adhesion: The resin supports flexible, well-adhered cured films across a range of substrates.
Typical Applications
Epovion BPF-L 17 is primarily used in solvent-free coatings and self-leveling flooring systems, where its low viscosity supports easy application and good substrate wetting without VOC-emitting diluents. It is also widely applied in adhesive systems and civil engineering formulations, including grouts, crack injection resins, and structural bonding compounds where flow into narrow gaps and cracks is essential.
Beyond coatings and adhesives, the resin is suitable for electrical insulation materials and molding and casting systems, where low viscosity supports void-free encapsulation of components. For applications where a standard bisphenol-A liquid resin is preferred for cost or performance reasons, formulators may wish to evaluate Epovion BPA-L 17 alongside this grade.
Technical Specifications
- Chemical type: Diglycidyl ether of bisphenol-F (DGEBF)
- Physical state: Liquid
- Epoxide equivalent weight: 160-180 g/eq
- Viscosity (25°C): 2,000-5,000 cps
- Color (Gardner): 3.0 max
- Specific gravity (25°C): 1.18
- Function: Low-viscosity epoxy resin base for solvent-free systems
Bisphenol-F Chemistry & Low-Viscosity Performance
The lower viscosity of Epovion BPF-L 17 relative to bisphenol-A epoxy resin stems directly from its molecular structure: the methylene bridge connecting the two phenol rings in bisphenol-F is smaller and more flexible than the isopropylidene bridge in bisphenol-A, reducing intermolecular resistance to flow at equivalent epoxide equivalent weight. This lets formulators achieve the low application viscosity needed for solvent-free coatings, self-leveling floors, and casting systems without diluting the resin, preserving crosslink density and cured film properties that reactive diluents can otherwise compromise.
The lower viscosity of Epovion BPF-L 17 also improves penetration into porous substrates such as concrete and wood, and supports faster air release and better wet-out of fillers, pigments, and reinforcing fibers in filled or reinforced formulations. Formulators working with sensitive substrates should note that, while similar in reactivity to bisphenol-A resin, bisphenol-F systems can show slightly different cure kinetics with certain amine hardeners and should be evaluated with the intended curing agent before full-batch formulation.
Storage Recommendations
- Store in the original, tightly sealed container, protected from moisture.
- Recommended storage: room temperature, away from direct sunlight and heat sources.
- Shelf life: Up to 12 months in the original, unopened packaging when stored under recommended conditions.
- Crystallization may occur at low storage temperatures; warm gently and mix well before use if this is observed.
Documentation & Compliance
Each shipment of the product is supported by standard quality and compliance documentation to help customers manage incoming inspection, formulation approval, and downstream regulatory reporting.
- Certificate of Analysis (COA): Provided per batch
- Safety Data Sheet (SDS): Mandatory prior to handling
- Labels: Prepared in accordance with applicable regulations
- Industrial and professional use only
Formulation Guidance
Epovion BPF-L 17 is typically cured with amine, polyamide, or anhydride hardeners selected to match the target application, with stoichiometry based on the resin’s epoxide equivalent weight of 160-180 g/eq. In solvent-free coatings and flooring systems, the resin’s low viscosity allows high filler loading while maintaining workable application viscosity, supporting cost-effective, low-VOC formulations.
For civil engineering and adhesive applications requiring crack injection or narrow-gap penetration, the resin can be used neat or lightly diluted depending on the required cure speed and flow characteristics. For general-purpose formulations where a bisphenol-A liquid resin is preferred, formulators may wish to evaluate Epovion BPA-L 12E as a complementary grade.
Packaging & Logistics
- Packaging: Approved industrial packaging (225 kg drums standard)
- MOQ: Subject to packaging configuration
- Lead time: Indicative lead time, to be confirmed upon order acceptance
- Incoterms: Quoted case by case
Epovion BPF-L 17: Safety & Handling
Epovion BPF-L 17 should be handled in accordance with standard industrial hygiene practices for liquid epoxy resins. Users are advised to review the Safety Data Sheet prior to handling and to implement appropriate personal protective equipment and engineering controls as specified therein, since uncured epoxy resins can cause skin and eye irritation and sensitization with repeated contact. As with all epoxy resins, small-scale compatibility and cure trials are recommended before full-batch formulation to confirm viscosity, cure profile, and mechanical properties in the target system.
Safety Data Sheet and destination-compliant labeling information for the product are available upon request. For related epoxy resin options, see also Epovion BPA-L 17 and Epovion BPA-L 12E.