Key Features
- Bisphenol-A based liquid epoxy resin
- Lower viscosity for improved processing and flow
- Suitable for general-purpose and electronic epoxy systems
- Compatible with common polyamine and polyamide curing agents
- Designed for industrial and professional use
Typical Applications
- Laminates
- Filament winding
- Encapsulation and potting
- Civil engineering and tooling
- Industrial adhesives
Technical Summary (Indicative)
- Chemical type: Bisphenol-A epoxy resin
- Supply form: Liquid (undiluted)
- Function: Epoxy resin / binder
- Appearance: Clear to pale liquid
Note
- Indicative information only. For specification limits and test methods, please refer to the official Technical Data Sheet.
Documentation & Compliance
- Certificate of Analysis (COA): Provided per batch
- Safety Data Sheet (SDS): Available upon request
- Labels: Prepared in accordance with destination requirements
- Industrial use only
Packaging & Logistics
- Packaging: Available in standard industrial packaging
- MOQ: Subject to packaging type
- Lead time: Indicative lead time, to be confirmed upon order acceptance
- Incoterms: Quoted case by case